Yangtze Memory Technologies to Debut New 3D NAND Architecture and Deliver Keynote at Flash Memory Summit 2018
WUHAN, China,- Yangtze Memory Technologies Co., Ltd (YMTC), a new player in the NAND industry, will be joining Flash Memory Summit this year for the first time, delivering a keynote address to reveal its technology – Xtacking™. YMTC is the first Chinese company to take part in the high-entry-barrier NAND flash memory industry with its new architecture for unprecedented performance, higher bit density, and faster time-to-market.
Simon Yang, YMTC CEO, will deliver a keynote address, Unleashing 3D NAND’s Potential with an Innovative Architecture, on August 7th, from 3:00 p.m. at the Mission Ballroom in the Santa Clara Convention Center, where he will illustrate how the company’s new technology can increase NAND I/O speed up to DRAM DDR4 while delivering industry-leading bit density, marking a quantum leap for the NAND market.
The Xtacking™ technology will enable the production of NAND that has unprecedented I/O speed and as a result, increase the performance of NAND solutions such as embedded UFS, client SSD, and enterprise SSD to a level that is unheard of. With help from customers, industry partners, and standard bodies, Xtacking™ will bring in a whole new chapter in high performance NAND solutions for smartphone, personal computing, data center, and enterprise applications.
The Xtacking™ technology enables parallel processing of the NAND array and periphery. This modular approach to 3D NAND development and manufacturing will shorten the time-to-market for new generation of 3D NAND and open the possibility for customized NAND flash products.
About Yangtze Memory Technologies Co., Ltd (YMTC):
Founded in 2016 with $24B funding, Yangtze Memory Technologies Co., Ltd. (YMTC) is a memory solutions company headquartered in Wuhan, China. YMTC designs, manufactures and sells memory products and solutions for a broad range of applications including mobile devices, computing, data centers and consumer electronics for customers around the world.
Leveraging its wholly-owned subsidiary XMC’s existing 12-inch IC fab in Wuhan, its more than 10 years of memory and specialty IC R&D experience, and international partnerships, YMTC successfully designed and manufactured the first 32-layer 3D NAND flash chip in 2017. With over 3,000 employees and worldwide R&D centers, YMTC is committed to becoming a world leading memory solutions provider through technology innovations.
