Wednesday, October 30
11:00 a.m. — 12:00 p.m. EDT (U.S.)
Join us to review results of the recent iNEMI survey on edge vs. vertical coupling to photonic integrated circuits (PICs) and discuss the development of a demonstrator module. The survey was conducted as part of the ongoing Board-Level Optical Interconnect project, a collaborative effort between iNEMI and IPSR-I (Integrated
Photonics Systems Roadmap-International). The responses helped identify which design and performance attributes are of greatest importance to PIC manufacturers and users. This webinar will summarize the inputs received from across the supply chain, and results of the survey will be incorporated into the design specifications of an optical demonstrator module which the team is considering assembling in the next 24-month period.
This webinar is open to members and non-members. To register, go to:
Image courtesy of Tyndall National Institute, Ireland.