U.S. Department of Commerce Begins Accepting Pre-Applications for CHIPS Program

Next week, the Department of Commerce will begin accepting pre-applications for large-scale supply chain projects, as well as wafer manufacturing facilities, with capital investments greater than $300 million. The application portal will open and begin accepting pre-applications on a rolling basis on September 1, 2023. 

The CHIPS Program Office encourages applicants to submit an optional pre-application before submitting a full application. Pre-applications serve as an opportunity for the CHIPS Program Office to provide meaningful feedback to applicants before preparing a full application package. 

An additional funding opportunity will be released in the fall for supplier projects below the $300 million capital expenditure threshold with a tailored application that smaller businesses can navigate. Read more here about supply chain funding opportunities.