January , 2018 – Taipei, Taiwan – Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join IPC APEX 2018 held at San Diego Convention Center on February 27th – March 1st featuring innovative one-stop inspection solution for Industry 4.0-based PCBA manufacturing. Visit booth #1317 to see TRI’s all new 3D SPI, 3D AOI, 3D Planar CT AXI and ICT solutions in action and discuss your inspection requirements with TRI’s experts.
Planar CT X-Ray
Planar Computed Tomography (CT) X-Ray inspects effectively PCBAs layer by layer without in not invasive way achieving unbeatable inspection depth. Recommended for the inspection of solder volume, double-sided multilayer-boards and defects such as head-in-pillow.
TRI’s VP of Sales and Marketing Jim Lin commented on the occasion, “We are honored to announce TRI’s innovative Depth from Focus 3D AOI technology. TRI’s cutting-edge TR7700Q DFF 3D AOI guarantees 1µm ultra-high resolution and 01005in chips. We are eager to share TRI’s innovations with our partners and the rest of the SMT Industry.”
TRI is eager to showcase the revolutionary TR7700Q 3D AOI with Depth from Focus (DFF) module and stop-and-go technology to optimize the inspection of complex PCBs, delivering high speed, high accuracy and high reliability testing.
Depth from Focus
Depth of Focus (DFF) is a revolutionary 3D sensing technique that searches for the optimal focus position and measures the depth of the image. The DFF algorithm will create 3D model of the component and its surroundings.
TRI’s portfolio for IPC Apex 2018 will include the Global Technology Award-winning TR7007QI 3D SPI, along with market leading 2D + 3D AOI solution TR7500QE. Both systems deliver industry leading performance based on CoaXPress Imaging Technology. TRI will showcase its hallmark inline PCBA inspection solution, the TR7600 SIII series CT AXI, including TR7600 SIII and TR7600F3D. Built with planar CT and high density boards in mind allows the TR7600 SIII series models to rapidly deliver very clear 3D X-ray images using high speed cameras with advanced image processing.