February 27, 2018, Tokyo, Japan—Toyochem Co., Ltd., a member of the Toyo Ink Group of Japan, announced today that it will be exhibiting at the Applied Power Electronics Conference and Exposition 2018 (APEC 2018), a global event for applied power electronics. APEC 2018 will take place March 4 to 8 at the Henry B. Gonzales Convention Center in San Antonio, Texas, USA.
Featured at the Toyochem booth #1429 will be the LIOELM™ FTS series of thermally conductive adhesive sheets for use as an insulation material in power devices. LIOELM FTS sheets were developed by using Toyochem’s advanced heat-resistant resins, which were in turn based on its original polymer design technology. This proprietary resin results in a highly heat-conductive product with excellent flexibility and reliable heat-dissipating properties.
“We are excited to debut LIOELM FTS adhesive sheets at APEC 2018,” stated Masashi Arishima, General Manager of Toyochem’s New Material & System Business Department. “At this, our first APEC exhibition, we look to expand our position in the global power electronics market, particularly in the United States and Europe where the popularity of electric vehicles is surging. LIOELM FTS prototypes are currently being evaluated by Japanese auto manufacturers as a way to dissipate heat from LED light modules and other power devices. We are now prepared to address the global demand for higher heat-conducting materials as the increased use of power LEDs and power devices for automotive and other applications is expected to grow in years to come.”
Also on display at the Toyochem booth will be the LIOMETAL™ SB series of nano-silver pastes for high heat-resistant and pressureless sintering of a semiconductor chip to a circuit board. The company’s original nano-particle design allows LIOMETAL pastes to create uniform layers of sintered silver that exhibit both excellent durability and adhesion under high temperatures.
For more information on APEC 2018, visit www.apec-conf.org/.