TopLine Exhibits CCGA Solder Joint Reliability Solutions at NEPCON China 2018

Irvine California, USA – TopLine will exhibit for the 5th straight year at NEPCON China in Shanghai, in Stand #1A21. Featured products will include CCGA – Column Grid Arrays and Daisy Chain BGA test vehicles. TopLine’s CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs) and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions. “Many people are still unaware of the benefits that solder columns provide to reduce stress caused by CTE mismatch when interconnecting area array packages and the PC board,” Hart adds. For more information, and a quick chart of TopLine CCGA products, visit http://www.topline.tv/CCGA.html.

NEPCON China 2018 will be held April 25 – 27 at the Shanghai World EXPO Exhibition & Convention Center. NEPCON China is a prestigious professional trade platform and exhibition on SMT (surface mount technology) and EMA (electronics manufacturing automation). It brings together over 450 renowned brands from the electronics manufacturing industry around the globe with innovative equipment, materials, and system integration solutions. TopLine has been active in promoting its products in the China market for more than 20 years.