Morgan Hill, California, USA — TANAKA Precious Metals announced today that it has recently broadened its range of Type AuR Gold Ribbon Bonding Wire.
Type AuR Gold bonding ribbon is fabricated to 4N specifications with 99.99% purity using a dry process. Sizes range from 12.7µm to 50µm thickness. Widths range from 25µm to 250µm wide. AuR Gold bonding ribbon is typically packaged on 2-inch high-purity ribbon spools with lengths up to 100 meters.
TANAKA’s proprietary process uses no lubrication oils during fabrication, thus providing the benefits of excellent corrosion resistance and no material build-up during bonding. Type AuR Gold bonding ribbon is produced using a rolled process with stress relief. The edges are smooth without sharp corners, providing good surface smoothness that enables a stable bonding process.
Type AuR is an excellent solution for RF devices, high reliability applications and high-power applications such as laser and Microwave devices. AuR is fabricated in Japan on world-class production lines.
Type AuR Gold bonding ribbon is stocked in North America by TOPLINE through its distribution agreement with TANAKA and will be exhibited at The Battery Show and at the Electric & Hybrid Vehicle Technology Expo in Novi (Detroit), Michigan, September 11-13, 2018. To learn more, please visit www.TanakaWire.com or call 800-776-9888.
TopLine manufactures a wide range of daisy chain semiconductor packages for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers. Contact TopLine Corporation, Tel (800) 776-9888; Email: info@TopLine.tv.
About TANAKA Precious Metals
Founded in 1885, the TANAKA Precious Metals group has grown to be a diversified precious metals leader first in Japan, and now in the rest of the world. Contact TANAKA America, Inc., 235 Vineyard Court, Suite 150, Morgan Hill, CA 95037, Tel 408.778.3217; http://pro.tanaka.co.jp/en, or LinkedIn profile at