SMTconnect – the heartbeat of electronic production meets in Nuremberg

Personally greeting customers and reconnecting, presenting their companies, products, solutions as well as providing trade visitors insights into their technologies is at the heart of the event for exhibitors this year: “No web-based conferencing technologies can beat meeting our customers personally,” commented Brian Craig, Managing Director of Indium Corporation’s European operations.

Dieter Weiss, founder of European EMS research firm in4ma, commented that the overall impression he had of the show this year was similar to productronica 2021. “Show participation has not yet returned to full speed; I still see lots of free exhibitor space, but these are good quality visitors, and there have been many good discussions. Those attending are happy to be back live instead of on Zoom and Teams,” he concluded.

Dieter hosted an event on Wednesday that was attended by industry illuminates, including IPC CEO John Mitchell. in4ma’s team included Matthias Holsten, Michael Kuensebeck and Dieter G. Weiss, pictured at their booth. At their booth with clients and during several public presentations, they discussed developments in the electronics industry,  new insights in EMS market research in Europe, and their digital EMS buyers guide for Europe (EMS-SCOUT) and about sales and marketing in the EMS industry.

Cogiscan is proud to attend SMTconnect in Nuremberg, Germany. Inspired by SMTconnect’s motto “manufacturing together” their team looks forward to reconnecting with many partners, customers, and long-time friends again in-person. 

“I personally haven’t traveled in over two years for business, and I am quite eager to attend SMTconnect. I look forward to both discovering and discussing all the exciting improvements in AI, robotics, and other automation technologies now available to electronics manufacturers,” said André Corriveau, Chief Innovation Officer at Cogiscan. 

Reconnecting with partners will be the focus of many attendees’ visits to the exhibition, since face-to-face interactions are so few and far between nowadays.

The Cogiscan team will share exciting updates – including information about the new and very popular TTC Fix product, a powerful AI-based solution for pre-solder optical inspection with complete defect and repair management. Quickly detecting the most common errors for surface mount and thru-hole, TTC Fix is centered on a 2D inspection machine powered by an AI and machine-learning platform, with a neural network that allows for NPI in under 5 minutes. It also includes an intuitive, visual repair guide tool and complete traceability reporting of all defects.

IDENTCO Hall 4, Booth 160

IDENTCO, the leader in durable label automation solutions for track and trace applications, is pleased to announce that it will showcase its electronics identification solutions in Hall 4, booth 160 at the SMTConnect Expo.

IDENTCO’s electronics identification solutions offer extreme durability, solvent and chemical resistance, and anti-static properties for applications that range from PC Board assembly to industrial automation. Their Printed Circuit Board and Electronic Component labels are designed to withstand the challenges presented by high heat, fluxes and cleaning solutions. Print-on-demand solutions include printers, application-matched labels and ribbons, and label feeders designed for use in most SMT pick and place machines.

• 100% traceability of PC Boards during manufacturing and after processing in the field
• Designed to survive harsh wash processes
• Auto-apply labels remove human error
• Anti-static properties

For sales, support, or additional information about IDENTCO products and services, please stop by Hall 4, Booth 160 at SMTConnect in Nuremberg, or visit www.IDENTCO.com.

Indium Hall 5, Booth 320

The Indium team will also be quite busy. Indium Corporation expert Andreas Karch, regional technical manager and technologist – advanced applications, and Ralf Sedlatschek, head of technology, KATEK Group, will co-present their joint process development on a materials solution to prevent hotspots in thermally-critical components at SMTconnect, May 10, 11:40 a.m.-Noon, Nuremberg, Germany.

In their German-language presentation, Solder Material for Mounting Thermally Critical Components, Karch and Sedlatschek, will share the results of a joint process development project designed to guarantee the prevention of hotspots under thermally critical components utilizing a standard reflow process.

To learn more about Indium Corporation’s suite of proven products, visit indium.com/auto or stop by its booth (#5-320) at the show.

Andreas Karch provides technical support on solder paste and preforms, fluxes, and thermal management materials to Indium Corporation’s customers in Germany, Austria, and Switzerland. Karch has more than 20 years of automotive industry experience in PCB and power electronics, including the advanced development of customized electronics. He received an award for developing one of the top 10 innovative patents for automotive LED assembly. Karch is an ECQA-certified integrated design engineer and holds a Six Sigma Yellow Belt. His thorough understanding of process technologies and project management skills reinforces Indium Corporation’s commitment to providing world-class service to its customers in Europe.

Ralf Sedlatschek is the head of technology and radiation protection officer for KATEK Grassau. He is a state-certified engineer with more than 30 years of industry experience. His professional experience includes measurement engineer and quality manager for toolmaking and aviation industries; he has held multiple technical leading positions with KATEK Grassau since joining the company in 2005.

Koh Young Europe Hall 4A, Booth 233

The Koh Young Europe Team are live at this year’s NürnbergMesse GmbH, Germany. Visit their team of experts in Hall 4A, Booth 233 to discuss inspection issues and view our award-winning technology.

Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will highlight an array of award-winning inspection and measurement solutions at SMTconnnect in booth 4.A-233 on the NürnbergMesse event grounds during 10-12 May 2022. The following is just a glimpse into what Koh Young will have in store for our visitors at the tradeshow:

Solder Paste Inspection (SPI)

In 2002, we introduced the concept of 3D measurement-based solder paste inspection – and it revolutionized the inspection industry. Today, manufacturers recognize the value of the 3D measurement data and use the data to improve the print process, in turn, improving production yield and quality. Today, 3D SPI has become a standard requirement for SMT lines – it is no longer optional. The KY8030-3is our SPI workhorse, and the most popular SPI solution in the electronics manufacturing market. With a patented dual-projection technology, we deliver trustworthy measurement data, which manufacturers can use to reliably optimize the print process.

Automated Optical Inspection (AOI)

The Koh Young 3D AOI Zenith delivers perfect inspection performance with True 3D measurement technology. In the 2D inspection world, false calls and escapes are unavoidable. To solve this problem, we took a different approach. We based our solution on full 3D measurement technology, not 2D technology and its inherent shortcomings or 2D with some 3D capabilities bolted-on to help. At Koh Young, the Zenith measures all components in True 3D. We find the component body based on true 3D profilometric information. Using this approach, we provide trustworthy inspection results, regardless of component or board color variations. Building on the Zenith AOI, we have the Meister, which is the industry’s leading inspection systems for advanced packaging & semiconductors. When our 3D measurement data combines with our A.I. engine, we deliver even more advantages.

Zestron Hall 4, Booth 329