Minneapolis, MN – SMTA is excited to announce the technical program has been finalized and registration is now open for the South East Asia Technical Conference on Electronics Assembly. The event will be held May 8-10, 2018 at the MITEC in Kuala Lumpur, Malaysia.
Professional Development Courses will be held on Tuesday, May 8. In the morning, AF Ng, Techment Consultancy Sdn. Bhd., will instruct the course, “Understanding Parameters Affecting Barrel Fill in Wave Soldering Process.” In the afternoon, John Lau, Ph.D., ASM, will instruct the course, “Flip Chip, WLCSP, and FOWLP Assembly and Reliability.”
Session topics for May 9 and 10 include: Design, Manufacturing and Assembly Rework; Conformal Coating and Product Reliability; Inspection and Quality; Big Data and Manufacturing Considerations; Paste Printing and Soldering; Cleaning Challenges for Board Assemblies and Harsh Environments; and Advanced Packaging.
The SE Asia Technical Conference on Electronics Assembly Technology is co-located with SEMICON Southeast Asia, in partnership with SEMI and supported by Persatuan Surface Mount Technology P. Pinang.