SEHO Announces Innovative Solution to Reduce Solder Defects

Automatic Nozzle Height Adjustment Reduces the Potential for Soldering Defects in Wave Soldering Processes

The most common soldering defects in wave soldering processes are errors due to poor wetting, especially if the assembly or the soldering mask layout is demanding. Depending on the mask thickness and size of the cut-outs, reliable wetting of all solder joints is not always guaranteed. In addition, small distances between the covered components and the pins of the components to be soldered can become a challenge.

Smart functions such as the automatic nozzle height adjustment of the SEHO MWS 2300 are an innovative solution for such applications. The height of the solder nozzles can be adjusted individually and software-controlled in order to always have the optimum distance between the PCB and the solder nozzle, depending on the product. Up to 16 different sections of an assembly can be processed with an individual nozzle height.

This makes the entire process independent of the workpiece carrier or assembly design without affecting the cycle time. All solder joints can be reliably wetted, significantly reducing the risk of soldering defects.

As a result, the automatic nozzle height adjustment ensures additional process reliability and an improvement in product quality. At the same time, it offers maximum flexibility and thus ensures the future viability of the wave soldering system with regard to new applications.

For more information, visit https://www.seho.de/en/reliable-wetting-in-wave-soldering-processes/