Saki will demonstrate 2D and 3D AOI systems at NEPCON Asia booth 1G35
Tokyo, Japan – Saki Corporation, an innovator in the field of automated optical and x-ray inspection and measurement equipment, will exhibit its 2Di-LU1 2D bottom-side automated optical inspection (AOI) system at NEPCON Asia along with its 3D AOI and solder paste inspection (SPI) systems and M2M capabilities for ensuring defect-free electronics for automotive and mobile applications. To demonstrate the speed and effectiveness of its 2D bottom-side AOI, Saki is collaborating with Ersa, Wertheim, Germany, to inspect the bottom-side of a printed circuit board assembly (PCBA) after Ersa’s SMARTFLOW 2020 selective soldering process.
“We are pleased to be able to collaborate with Ersa in presenting selective soldering and 2D bottom-side inspection,” said Zheng Ri, general manager of Saki Shanghai Co, Ltd. “As the industry incorporates M2M communication for its high-speed assembly operations, it becomes even more important to join with other equipment manufacturers to ensure that together we have an assembly process that best meets the stringent demands of the market and our customers.
NEPCON Asia (formerly South China), is being held from 28- 30 August 2019, at the Shenzhen Convention and Exhibition Center, Shanghai, China. Saki will be in booth 1G35.
For more information contact Saki at firstname.lastname@example.org, or visit our website at www.sakicorp.com or www.sakiglobal.com.