Printed Circuit Engineering Association (PCEA) announce that the first UHDI & Substrates: Design to Package Forum will be held on June 5, 2024
PEACHTREE CITY, GA – The Printed Circuit Engineering Association (PCEA) announced the first UHDI & Substrates: Design to Package Forum will be held on June 5, 2024, in conjunction with PCB East in Boxborough, MA. UHDI, or ultra high-density interconnect, describes lines and spaces of less than 25 microns on a printed circuit board. Among the presentations are talks on standards, electro-hydrodynamic (EHD) printing, direct imaging, a new mSAP process, a new replacement for ABF (Anjinomoto Build-Up Film), planning a new UHDI facility, and new materials for UHDI. Each presentation will be 30 minutes. The program will close with a panel discussion.
The forum is chaired by Gene Weiner of Weiner International Associates. Peter Bigelow, president of FTG East, and Alun Morgan, technology ambassador of Ventec and president of the European Institute for the PCB Community (EIPC) are vice chairmen.
“Rapid technical progress and major dollar commitments are being made in the US and Europe to establish sustainable, secure sources of organic substrates and UHDI circuitry for advanced electronics packaging,” said Weiner. “This forum is designed to present new design, process, material, and equipment capability information that delegates can immediately put
to use.”
“The industry has begun to recognize the need for – and challenges of – UHDI technology,” added Mike Buetow, president of PCEA and conference chair of PCB East. “Gene Weiner and his colleagues have put together an outstanding program that will look at the state-of-the-art and the requirements for implementation.”
