Packaging is ‘A Serious Challenge for the Defense Industrial Base,’ Warns PCBAA

The Printed Circuit Board Association of America applauds the Pentagon’s recently announced $46.2 million award to an American company to produce the latest integrated circuit substrates, high-density and ultra-high-density interconnects and advanced packaging.

The millions of dollars being distributed by leaders at the Pentagon are an important first step. But this critical industry requires investments and tax incentives in billions – not millions – to restore America’s leadership position in microelectronics.

Chips don’t float.

Despite semiconductors’ rockstar status they are only one third of the technology stack.

New chips produced in the U.S. funded by the CHIPS Act will still end up being shipped to Asia to be packaged with substrates and PCBs…made in Asia. We are exacerbating the supply chain issue by not addressing the entire technology stack.

Today every defense system is dependent on microelectronics. It is time for Congress to provide support for American-made microelectronics beyond semiconductors.

Without further investments in printed circuit boards, substrates, and the ability to do advanced packaging, our national and economic security remains at grave risk.

For more information and to speak with representatives from the PCBAA and member companies, contact:

Mike Doble

mikedoble@pcbaa.org

(703) 579-7963