San Francisco, California, USA – TopLine Corporation, an innovator of component packaging solutions, will partner with TANAKA Precious Metals, a leading supplier of bonding wire for Semiconductor applications, in booth #504 at upcoming SEMICON West 2018 in San Francisco from July 10 – 12.
A featured product in the booth will be TANAKA Gold Ribbon Bonding Wire, suited for high power, high temperature, solar, and RF applications. Ribbon sizes are 50µm to 250µm wide (2mil to 10mil). TANAKA Gold ribbon is made using a rolled process; edges and surfaces are smooth, with no sharp edges.
TopLine offers a full range of TANAKA bonding wire in four alloys: Gold, Aluminum, Silver, and Copper, in standard lengths on spools: 50m, 100m, 300m, 500m and 1000m, depending how much the customer needs on the spool. Wire is packaged on two-inch spools as well as half-inch spools for industry standard manual or automated bonding machines.
In addition to TANAKA wire, TopLine will also exhibit its innovative CCGA Column Grid Array IC packages will be exhibited. CCGA’s are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs) and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions.