Omron introduced a series of new 3D Automated Inspection products to the professional public this year in Munich at the leading European trade show. The company presented the global release of their latest 3D-AXI system utilising Computed Tomography (CT), claiming to be the world’s fastest CT X-ray inspection system. Conventional AXI methods are no longer sufficient to detect hidden solder defects, for instance HiP and voids under BGA or LGA devices and Barrel Fill in THT Connectors. X-Ray Inspection Systems (AXI) enables these hidden solder points to be tested with minimal time expenditure. However, with the new VT-X750, Omron has once again raised the bar for cycle time and High Capability Solder Joint Inspection.
Omron showcased their latest sensing technologies within their new 3D-AOI machines. The two new product entries, the VT-S530 and VT-S730-H, provide high quality Solder Joint Inspection technology, called SJI. Besides this, Omron presented their new VT-X750, the world’s fastest automated X-Ray Inspection System (AXI) to utilise computed tomography as its core of image and inspection quality.
The new VT-S530 provides full 3D-AOI capability. The machine is high-performance AOI, with the largest first-pass yield, zero escape, and fewest false rejects. The technology available on the VT-S530 has been proven ultra-performant on the existing VT-S730 and especially on the VT-S730-H, with which it is sharing the new Image-Capture Module. The VT-S530 offers great versatility in application as it can be used on pre or post reflow inspection, single or dual lane; it is 01005 compliant and has the possibility to inspect XL boards of 510 mm x 680 mm.
The second new machine, called VT-S730-H, combines the high performance of the VT-S730 with high inspection speed for the most demanding electronic production requirements. The VT-S730-H post reflow inspection machines have been widely adopted in production lines where stringent quality control is required, including the automotive industry. The result is a real 3D-AOI inspection machine offering 3D full component and solder inspection capabilities.
The highlight at the Omron stand was the world fastest inline automated X-Ray Inspection System, the VT-X750. The VT-X750 increases the automated inspection speed based on 3D-computed tomography (3D-CT). The expanding inspection logic enables full, in-line inspection coverage by the 3D-CT method. OMRON’s unique 3D-CT reconstruction algorithms provide unprecedented solder-shape recognition and defect detection. Dense and dual-sided board design can present challenges for X-Ray inspection. However, Omron’s 3D-CT technology can overcome such design restraints. The VT-X750 also offers the possibility to inspect XL boards up to 610 mm x 515 mm for a foot print of nearly 50% less than other Large Size AXI machines with only 2.99 m2.
“With the VT-X750, we’re talking about a target group that has the greatest throughput in the least time. The VT-X750’s cycle times are up to two times faster than with conventional AXI platforms. So the performance increase leads to a very great throughput. Added to this is the X-ray inspection of hidden solder points, which is a large added value for the global electronics manufacturer. That’s why suppliers in the consumer-goods industry, but also especially the automotive industry, were interested in the VT-X750”, says Francis Aubrat, European Automated Inspection Business Manager, looking back. Nearly all of the well-known car manufacturers from Germany and their suppliers have registered for evaluation tests at Omron in the Netherlands during the coming weeks.