During last month’s Productronica global electronics event in Munich, Germany, the electronics business of Henkel Adhesive Technologies took the top prize in its category for the Global Technology Awards contest, while Technical Service expert Richard Boyle was selected to share his know-how during a live video panel discussion about automotive reliability and testing. Together, these high-profile honors served to further illustrate Henkel’s electronic materials leadership position and the company’s effective total solutions approach.
At a special ceremony hosted by contest sponsor Global SMT & Packaging Magazine on November 14th, the Global Technology Awards highlighted the best new products and services in the electronics industry. Henkel’s Technomelt AS 8998 won the prestigious distinction in the competitive category of Adhesives/Encapsulants/Coatings/TIMs. Technomelt AS 8998 is a unique hot melt material that is used to mask keep out zones prior to conformal and chemical vapor coating processes. A fast, highly-precise, automated alternative to manual taping techniques, Technomelt AS 8998 facilitates a streamlined dispensing solution that dramatically reduces application time. The material peels off cleanly, leaving no residue. Manufacturers incorporating the product in their operations have reported as much as a 40% cost reduction as compared to conventional approaches.
Accepting the award on behalf of Henkel, Giuseppe Caramella commented on the hot melt material’s significance: “It is indeed an honor to be recognized with this award for such a transformative product,” says Caramella. “Increasing productivity, reducing cost and simplifying processing is what Technomelt AS 8998 delivers and we are grateful to the judging panel for appropriately noting the material’s positive impact on the electronics assembly industry.”
On the last day of the Productronica event, Henkel ́s technical customer service expert Richard Boyle shared his decades of material behavior expertise as it relates to automotive reliability and testing. Participating in a live broadcast debate moderated by Global SMT and Packaging Editor-in-Chief Trevor Galbraith, Boyle – alongside two other industry panelists – discussed the impact of automotive sensor proliferation on current and future reliability and testing practices. Voltage and current increases have put big pressures on thermal cycling reliability, particularly considering higher density, finer-pitch PCB assemblies. The discussion also covered the effect of chemistry compatibility, the lag between technology change and industry standards, and the effectiveness and selection of various testing procedures.