5G offers faster speed, almost zero latency and massive capacity. It is slated to change the world of connectivity. But what does that mean for laminate, solder paste and manufacturing in general? SCOOP’s Philip Stoten is joined by panelists, Ross Berntson, President and COO of Indium Corporation and Alun Morgan, Technology Ambassador at Ventec International Group and Chairman of EIPC to explore the opportunities and challenges related to 5G.
Filmed on location in the SCOOPstudio at Productronica, thanks to sponsors, Aegis Software, Cimetrix, Cogiscan, KIC, Koh Young and SEHO.