Eric Miscoll and Andy Mackie of Indium discuss the challenges of electronics in automotive applications, especially the extended mission profile. Indium is developing new solder formulations and new processes to address these technical requirements and Andy explains these advances, and much more.
HUBER+SUHNER to demonstrate plans for 5G and network densification at Optical Fiber Communication Conference 2018
March 13, 2018
June 26, 2018