MEMS and Sensors Tap AI, Blockchain, Machine Learning to Boost Personalization in Biomedical, Food Supply, IoT

MSIG MEMS & Sensors Executive Congress to feature business leaders examining market opportunities, innovations and technology trends

MILPITAS, Calif. –  Senior executives from across the MEMS and sensors supply chain will gather at MEMS & Sensors Executive Congress (MSEC), October 22-24, 2019, in Coronado, Calif. for the latest innovations driving widespread adoption of these tiny smart devices. Recent MEMS and sensor leaps support more personalized user experiences in biomedical/healthcare, the food supply chain, and Internet of Things (IoT). MSEC is hosted by the MEMS & Sensors Industry Group (MSIG), a SEMI Strategic Association Partner. Registration is now open with early-bird pricing available until September 20, 2019.

MSEC comes as manufacturers plan to embed more than 50 billion MEMS and sensors in thousands of applications by 2024 to meet consumer demand for more intelligence and interactivity in electronic products, according to Yole Développement.1 Featured speakers at MSEC will examine the enabling role of MEMS and sensors in diverse intelligent applications.

MSEC Keynotes and Other Speakers

Albert Pisano press photo
Albert Pisano, professor and dean, UC San Diego, will explore how MEMS will enable development of large-scale sensor-driven systems in smart cities, spanning healthcare, transportation, retail and education.
 UC San Diego Logo
Stefan Finkbeiner Press Photo
Stefan Finkbeiner, CEO and general manager, Bosch, will explain how software synthesis and artificial intelligence (AI) will enable MEMS-enabled consumer-electronic devices to automatically adapt to users.
Bosch Logo
Pete Warden Press Photo
Pete Warden, staff research engineer, Google, will describe how low-power, low-cost machine learning (ML) will enable hundreds of billions of embedded devices to turn raw sensor data into actionable insights.
Google Logo
Rachel Gabato Press Photo
Rachel Gabato, COO, ripe.io, will describe how sensors, AI, ML and blockchain technology underpin a radically transparent digital-food supply chain that maps foods’ journey from production and transportation to the dinner plate.
ripe.io Logo
John Smee Press Photo
John Smee, VP of engineering, Qualcomm, will explain enhancements to 5G Near Radio (NR) that will enable higher performance and more reliable connectivity in industrial IoT, vehicle-to-everything (C-V2X), and massive IoT devices (MIoT).
Qualcomm Logo

Additional MSEC Speakers

  • Alissa M. Fitzgerald, founder and managing member, A.M. Fitzgerald & Associates, LLC
  • Dave Monk, vice president and general manager, Motion Sensors, NXP
  • Michael O’Connell, chief analytics officer, TIBCO Software
  • Philip Perconti, director, U.S. Army Research Laboratory
  • Radislav Potyrailo, principal scientist, Micro and Optoelectronics, GE Global Research
  • Rajendra Rao, general manager, IBM Food Trust

Other MSEC Highlights

  • Technology Showcase where innovators will demonstrate leading-edge MEMS/sensors-enabled products and platforms
  • Networking Events including receptions and evening dinner

Premier Sponsors

Event sponsors include: GE, mCube, Microtech Ventures, Okmetic, OnScale, Rogue Valley Microdevices, Silex Microsystems, SUSS MicroTec and Teledyne DALSA

MSEC will take place at Coronado Island Marriott Resort & Spa in Coronado, Calif. For more information, including the full event agenda, please visit the MSEC website.

Stay in touch on Twitter: @MEMSgroup @SEMI #SEMI_MSEC

About MEMS & Sensors Executive Congress
Hosted by MEMS & Sensors Industry Group (MSIG), a SEMI technology community, MEMS & Sensors Executive Congress (MSEC) is the only US event at which industry executives can exchange ideas and information about MEMS and sensors in commercial applications, all while networking with partners, customers and competitors.

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

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