Masterbond Releases Lab Results on Adhesives for Titanium
The graph below shows the lap shear strength of various Master Bond epoxy adhesives for titanium to titanium. The coupons measured 4 x 1 x 1/16 inch. As preparation, their surfaces were roughened and cleaned with acetone. Supreme 10AOHT and Supreme 10HT present outstanding lap shear strength, not only for titanium but for other metals as well.
When choosing the proper adhesive, there are many other factors to consider, such as specific processing and operation conditions. For example if thermal conductivity is needed, Supreme 10AOHT may be desirable. If a room temperature cure is needed, EP21LV or Supreme 11HT may be better. For more information on Master Bond high strength epoxy adhesives, please contact our technical advisors.
Disclaimer: The findings in this article are not meant to be used for specification purposes.
High Lap Shear Strength Adhesives for Titanium
 |
Supreme 10HTOne part structural epoxy with high bond strength and excellent adhesion to similar and dissimilar substrates, especially composite materials. Requires oven curing at 250-300°F. NASA low outgassing approved. Serviceable from 4k to +400°F. Tough and durable. 85°C/85% RH resistance. |
 |
EP21TDCHTHigh strength, high temperature resistant, two part system with excellent bond strength and thermal cycling capabilities. Serviceable from -100°F to +350°F. Meets MIL-STD-883J Section 3.5.2 for thermal stability. Moderate viscosity. Superior toughness. Withstands vibration, impact, shock. Good dimensional stability. Convenient one to one mix ratio. Dependable electrical insulation properties. |
 |
EP21LVEpoxy adhesive, sealant, coating resists acids, alkalis and many solvents. Low viscosity room temperature curing. Contains no solvents. Serviceable from -60°F to +300°F. Castable to thicknesses exceeding 2-3 inches. Excellent electrical insulator. |
 |
Supreme 10AOHTOne part, oven cured epoxy system with excellent thermal conductivity and superb resistance to thermal cycling. Primarily used for bonding of heat sinks and sensors where heat transfer is desirable. Halogen free. Serviceable from 4k to +400°F. Convenient processing. |
