Masterbond Posts White Paper on Selecting Adhesive and Potting Compounds for High Power and High Frequency Electronics

Applications in these high technology systems have more challenging requirements than ever before. As device capability has increased so has the variety of adhesives and potting compounds that can be employed to meet these needs. Learn what chemistry options are available and how these formulations can ensure reliable long term performance even in high density designs.

Register to download paper here.

Recent Video

Loading...

Follow Us

Recent Videos

Newsletter

Share This