MacDermid Enthone Electronics Solutions to exhibit at the 2018 IMAPS Device Packaging Show

WATERBURY, Conn, USA, January 25, 2018– MacDermid Enthone Electronics Solutions (MEES), a global electronics chemicals supplier, will exhibit at the IMAPS Device Packaging show being held in Fountain Hills, Arizona, March 6-7, 2017.

MacDermid Enthone‘s Advanced Electronics Solutions (AES) business is a global leader in high performance semiconductor chemistries and assembly materials. OEMs, IDMs, wafer foundry engineers, tool suppliers, and OSATs should visit the IMAPS booth to collaboratively develop solutions that meet the fast paced semiconductor market demands. The AES team will highlight the MICROFAB family of products which provides advanced packaging solutions that exceed aggressive packaging design requirements and enable greater device reliability. MEES will showcase its chemical processes for IC substrates, including PackagePrep solderable finish for QFN sidewalls, and PackageBond leadframe adhesion promoter.

Eric Gongora, General Manager and Stretegic Marketing Director of Wafer Level Packaging, along with AES industry experts, will be available to discuss the challenges the semiconductor manufacturing sector faces as technology continues to push the limits of performance and miniaturization.

The booth will also include specialty product offerings from their sister company, Alpha Advanced Materials.  The combined technology, experience and product offerings make them the new industry leader in all materials for Advanced Packaging.

For more information on our latest product technologies, visit us at Booth 45/46.

 

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