Designed for laser diodes, infrared detectors, pump lasers and optical transceivers, the OptoTEC thermoelectric module offers superior heat pumping capability in a smaller and lighter footprint…
Global technology leader Laird (LRD: London) has developed a thermoelectric module (TEM) that accommodates a laser diode butterfly package. Primarily used to stabilize the temperature of sensitive optical components in telecom and photonics industries, the miniature OptoTEC Series is designed for applications that have lower cooling requirements of 10 watts or less. The OptoTEC Series combines a small geometric footprint of less than 13×13 mm with reliable and efficient heat pumping capacity.
A laser diode is used to create a light wavelength that travels long distances for communications. Signal loss can occur at this distance and a pump laser is used to strengthen the signal as it passes thru an optical device. Laser diodes are also bundled together to form a high-power laser than can cut thru materials. While the temperature of the package may reach 85 degree C, in order to maintain peak performance the OptoTEC Series is used to keep the laser diode operating temperature stable at around 25+/-0.5 degree C. TEMs offer precise temperature control accuracy achieving ±0.01°C. The OptoTEC thermoelectric module dissipates heat generated by the active optical component, which is around 1 to 2 Watts.
The OptoTEC design features reverse polarity that enables the thermoelectric module to heat or cool dependent on outdoor temperature. Providing a high coefficient of performance (COP) to minimize power consumption, the compact TEM delivers reliable solid-state operation with no sound or vibration to ensure long life operation with low maintenance requirements – resulting in lower total cost of ownership in laser diode applications.
The OptoTEC TEM is available in multiple configurations and surface finishing options. Assembled with Bismuth Telluride semiconductor material and thermally conductive Aluminum Oxide ceramics, the OptoTEC Series is designed for lower current and lower heat pumping applications. Custom designs are available to accommodate metallization, pretinning, ceramic patterns, and solder posts, however MOQ applies.
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