Seoul, South Korea – Koh Young Technology, provider of 3D inspection technology, showed the latest Meister-D for the SiP (System-in-Package) assembly process. This innovative technology was recently highlighted at SEMICON Taiwan in the Taipei Nangang Exhibition Center.
The latest Meister-D system is optimized for die inspection and ensures the fastest, most accurate measurement with an 8-projector inspection probe specialized for typical SiP components including microchips and die. The system allows full 3D die and crack inspection, plus 0201M (008004”) SMDs.
Additionally, this in-line 3D inspection solution for IC package manufacturing has a wide range of inspection capabilities including missing, offset, rotation, polarity, dimension, co-planarity, and more. The system intelligently
inspects for die cracking using AI-powered machine learning.
“Advanced packaging continues to undergo rapid changes,” commented Steven Choi, General Manager of Koh Young China. “There’s a reduction in the feature/component relationship and an increasing requirement for high sensitivity and throughput to handle the high-aspect-ratio structures. The Koh Young Meister series intelligently employs 3D metrology to help packaging facilities overcome such challenges.”
If you missed us at Semicon Taiwan, you can learn more about the absolute 3D inspection leader and its best-in-class inspection solutions at www.kohyoung.com