Chandler, Arizona – Not long ago, 2D inspection was the industry norm, but 3D inspection quickly proved itself as a more reliable technique. Today, true 3D measurement has become even more effective, especially when AI power analyzes the real data. But what is the difference between 3D inspection and 3D measurement, and how can AI improve your process?
The SMTA Rocky Mountain Chapter is pleased to announce its next Technical Session: “Design for Test and Spectrum Analysis.” The day will include several informative presentations focused on inspection techniques and DfX (Design for Excellence). This session will explore different methodologies for testing today’s assembly packages and implementing a test strategy to meet production process requirements. Mr. Allen Phung, Regional Sales Manager with Koh Young America will lead a session with a presentation on how 3D measurement benefits the electronics assembly process.
The SMTA event starts at 9:00am MST on Thursday, April 26, 2018 at the Mentor Graphics Training Center in Longmont, CO. Advance registration is strongly suggested. Register today on the SMTA Rocky Mountain Chapter page at www.SMTA.org. If you cannot attend the technical session, you can learn more about Koh Young and its best-in-class solutions at www.KohYoung.com.