ITASCA, IL — Kester will be exhibiting (booth #117) at SMTAI 2018, which will take place October 16-17 at the Donald Stephens Convention Center in Rosemont, IL. Kester’s booth will offer attendees the opportunity to learn more about new products including: NP505-LT Solder Paste, The Paste Designed for Low Temperature Applications; NP560 Solder Paste, The Ultra-Low Voiding Paste under QFNs;and WP616 Solder Paste, The Zero-Halogen Chemistry for Water-Soluble Applications as well as Kester’s High Reliability Product Line.

In addition to exhibiting, Kester will chair two technical sessions and will present the following four papers:
 Monday, October 15 at 3:30pm: Reducing Spatter in Flux Cored Solder Wires for Robotic Soldering Applications
 Tuesday, October 16 at 2:30pm: Rheology of Flux and Solder Paste II: Shelf Life Study
 Wednesday, October 17 at 8:30am: Selective Soldering Design for Reliability Using a Novel Test Board and SIR
Test Method
 Wednesday, October 17 at 2:30pm: Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB
Substrate – DoE Tests
To learn more about these sessions, please click her