Silicon-photonics-based transceiver modules are expected to provide the most cost-effective solutions for on-board interconnections in the future. However, before these anticipated benefits of silicon photonics can be realized, we must develop new high-performance and cost-effective solutions for optical packaging and connectorization.
The Board-Level Optical Interconnect Application Interest Group (AIG) organized a joint project between iNEMI and the Integrated Photonic Systems Roadmap (IPSR) to assess the performance of prototypes of board-level interconnect systems based on single-mode (SM) fiber, expanded-beam optical coupling, and silicon photonics transceivers. The objective was to evaluate existing and developing components and to identify gaps in the board-level technologies needed for practical implementation.
This webinar will review results of the project’s efforts to design, assemble and test a prototype on-board fiber optic interconnection system based on silicon photonic transceiver modules, single-mode fiber cables, and expanded-beam optical connectors for the package, backplane, and front-plane interfaces.
Presented by Tom Marrapode, Molex
Thursday, August 2, 2018
11:00 a.m. — noon EDT (U.S.)