Wire harness designers and manufacturers are on the front line of solving technical challenges in today’s electronics industry marketplace. These products play an even more significant role in the integration of electronic systems within automotive, aerospace, and industrial applications. At this conference, industry experts will focus on new methods, processes and designs that are being utilized to improve product quality and field reliability. Topics will include:
- 3D Printed Wiring
- Military and Defence Applications
- Aluminum Wire for Automotive Applications
- Next Generation Wire and Cabling Bundling
- Cross-Process Traceability
- Optic Fibers
- Anticounterfeiting Measures
Join us in Lyon, France as the topics will be presented by wire harness experts from:
- Sumitomo Electric Industries – ANTech Europe GmbH
- DiIT GmbH
- Selha Group
- International Institute of Obsolescence Management
Register now for this unique conference and learn how to address the issues you are facing. In addition to the technical sessions, attendees will participate in a networking dinner on Thursday evening!
IPC and WHMA would like to thank the program committee for developing the Wire Harness Innovation Conference. The committee consisted of the following: Rick Bromm, Altex Wire and Cable; Juan Navarro, General Dynamics European Land Systems; William Marais, id3 Technologies; Frederic Kalb, Panduit; W. Adam Simms, Panduit; Michael Schoening, q-products; Fadi Hanna, Scania; Jean-Francois Mahe, Selha Group.