IPC Urges U.S. Senate and House to Complete R&D Legislation Before August Recess

IPC is encouraging the U.S. Senate and House to complete action on slimmed-down R&D legislation, following a Senate vote clearing the way for a vote in the coming days. 

The Senate voted yesterday to proceed to debate on the bill, which includes more than $52 billion funding to implement the CHIPS Act and at least $2.5 billion for a new National Advanced Packaging Manufacturing Program. The motion passed 64-34, indicating strong bipartisan support. The bill may face additional changes as it is considered by the Senate. 

A sense of urgency is driving action on the bill. Senate and House leaders want to send the bill to the President before the August district work period, which begins on July 27. Failure to enact the bill this summer would likely postpone final passage until after the November elections. 

“IPC strongly supports passage of this bill,” said IPC President and CEO John Mitchell. “Companies engaged in standing up packaging and IC substrate facilities will have opportunities to tap into funding for R&D, new facilities, and workforce training through the programs authorized by the CHIPS Act. IPC is urging federal officials to structure these initiatives to deliver benefits across the electronics manufacturing industry.” 

“However, the CHIPS Act is not a panacea,” he added. “Instead, it is a meaningful first step in helping to rebuild the U.S. electronics manufacturing industry. The Executive Branch and Congress must continue to support – through long-term policy and funding – the larger ecosystem that sustains innovative, resilient, and secure electronics manufacturing.”  

For more information, visit www.IPC.org.