Markham, ON, Canada – SMTA is excited to announce the technical program has been finalized and registration is now open for the International Conference for Electronics Enabling Technologies. The event will be held June 5-7, 2018 in Markham, Ontario, Canada.
Five Professional Development Courses will be held on Tuesday, June 5. Two courses are scheduled for the morning: “Interconnections: PCB and Solder – Not Just Your Normal Failure Modes Any More” and “Stencil Printing – Intermediate Topics: Process Troubleshooting and Defect Prevention.” Three courses are slated for the afternoon: “Failure Analysis of Electronic Devices”, “Understanding Shock & Vibration”, and “Robust Coating Processes in the Factory: Methods, Critical Parameters, Problems and Remedies.”
Conference sessions on June 6 and 7 will cover Failure Modes, Reliability, Research from the Refined Manufacturing Acceleration Process (ReMAP) Consortium, Coating & Encapsulation, Imaging & Inspection, Solder and Solder Paste. A panel discussion on “Warpage Induced Defects and Component Warpage Limits” is organized for Wednesday with experts from Plexus, Rockwell Collins, and Akrometrix. Thursday’s panel on “Low Melting Point Solder Pastes” will feature experts from Indium Corporation, Alpha Assembly Solutions, and Nihon Superior.
Shawn Blakney, Senior Director of Global Technology and Innovation at Celestica, will provide the keynote presentation on Tuesday, June 5 on the topic of “The Automated and Digital Factory – Navigating Technology Disruption.”
The conference is co-located with the SMTA Ontario Expo on Wednesday, June 6, featuring 20 companies highlighting the latest manufacturing solutions.
The forerunner conference of ICEET, the International Conference for Solder and Reliability (ICSR), grew to be a premier technical conference for all aspects of solders, metallurgy and the solder interconnect process, through the period of conversion to lead-free solder, driven by RoHS and WEEE. The ICEET Technical Committee intends to continue the tradition of technical excellence, and broaden the scope to the wider enabling technologies, including design for assembly, test and reliability (DfX), packaging, assembly challenges for high density PCBs and components, potting and other methods to achieve high reliability in aggressive environments.