Session WA1 / Wednesday, April 17 / Room A / 16:40 – 18:20
Toki Messe, Niigata Japan
Be sure to join iNEMI at the International Conference on Electronics Packaging (ICEP) in Japan (April 17-20, 2019). Our session will feature results from three iNEMI projects as well as a report from the 2019 iNEMI Roadmap:
- Packaging Technology Roadmap and Electronics Manufacturing Challenges and Opportunities, Marc Benowitz (iNEMI)
- Benchmarking of Qualification Methodologies for New Package Technologies and Materials, Feng Xue (IBM)
- Inspection/Metrology Evaluation of Fine Pitch Test Vehicles for Advanced Packages, Masahiro Tsuriya (iNEMI)
- Molded Electronic Package Warpage Predictive Modelling Methodologies, Wei Keat Loh (Intel)
iNEMI CEO Marc Benowitz, Haley Fu and Masahiro Tsuriya, are attending ICEP. If you plan to be there and would like to meet while at the conference, please contact Masahiro Tsuriya (firstname.lastname@example.org).