iNEMI Releases Revised Event Calendar Posted by Jennifer Read | Apr 7, 2020 | News, Associations, Exhibitions iNEMI announces the following webinars and events Wafer/Panel Level Package Flowability and Warpage End-of-Project Webinar Session 1 (APAC and Americas) – April 7/8 Wafer/Panel Level Package Flowability and Warpage End-of-Project Webinar Session 2 (APAC and EMEA) – April 16 iNEMI Roadmap Highlights & Gap Analysis Series: Organic PCB – April 22 iNEMI Roadmap Highlights and Gap Analysis Series – April 29 PCB Warpage Characterization and Minimization End-of-Project Webinar – May 13 SEE MORE>>>>
