MORRISVILLE, NC — The International Electronics Manufacturing Initiative (iNEMI) today announced release of four additional chapters from its 2019 Roadmap. The latest chapters now available online are: Mass Data Storage, MEMS & Sensors, Optoelectronics, and Semiconductor Technology.
iNEMI’s roadmap is a global collaborative effort, developed by subject matter experts from all perspectives of the electronics manufacturing supply chain, including manufacturers, suppliers, consortia, government agencies and universities. Individuals from these diverse organizations share their expertise to help define the technology needs of key market segments by focusing on the market demands and functionality requirements of those segments. They also identify key technology developments anticipated and required within the supply chain to meet product needs between now and 2029.
Mass Data Storage — This chapter presents a comprehensive assessment of the historical and current state of mass data storage products along with promising means of increasing optical storage capacity in the future. It highlights such data storage trends as the migration of solid state/flash storage to 3D architectures, and reduced volume of hard disk drives (HDDs) due to stagnant IT spending, the migration from client/server to mobile/cloud systems, and higher utilization of HDD capacity. It includes updates and forecasts on trends in areas such as MRAM (magnetic random access memory) and SCM (storage class memory) technologies, as well as updates on developments in cost-effective tape storage solutions and evolving optical storage applications.
MEMS & Sensors — The 2019 MEMS and Sensors roadmap chapter focuses on several evolving application areas that are driving developments for such devices. As sensing capabilities move from standalone sensors to being integrated into system solutions they are being deployed across more diverse market applications. The need for trillions of sensors in applications such as wearables is also driving the industry toward hybrid flexible electronics, where silicon-based sensors are integrated on a flexible electronics platform and widely deployed. The chapter discusses the need for developing and improving capabilities in design, supply chains, diverse manufacturing, and testing to ensure reliable and secure performance in a myriad of applications, from agricultural monitoring to autonomous driving. It also addresses the shift to increasing sensing and analysis requirements at the Internet of Things edge (IoTe). A summary of technology needs for the next 10 years for the industry in representative application areas are presented.
Optoelectronics — As Internet traffic and the number of connected devices increase, larger volumes of data are produced, which continues to fuel optical technology development. The 2019 Optoelectronics chapter comprehensively addresses all aspects of data transmission that utilize optical technologies across distances of thousands of kilometers down to a few millimeters (on-chip) — including free-space optical communication used, for example, between spacecraft over interplanetary distances. As data rates rise in applications, optical technology continues to displace copper for data transmission. The 2019 Optoelectronics roadmap refreshes the chapter to the current situation for these various applications of optoelectronics and details the critical technical challenges that must be overcome to meet this demand. It also highlights the critical research and development needs in terms of manufacturing capabilities development and materials innovation, as well as identifying new areas of innovation that will be explored by research and industry over the next 10 years.
Semiconductor Technologies — The advent of fabless design houses and foundries has revolutionized the way in which business is done in the semiconductor industry with the needs of the products in key markets now driving integrated circuit (IC) device development. For example, no longer does a faster microprocessor trigger the design of a new PC. Instead, the design of a new smart phone generates the requirements for new ICs. In addition, fast-approaching fundamental 2D topological limits have impacted the ability of the semiconductor industry to continue scaling at historical rates. New, creative 3D transistors, memory cells, and overall IC structures are revolutionizing the way ICs are designed and manufactured. The 2019 Semiconductor Technologies chapter summarizes some of the major system characteristics in cloud computing, mobile, IoT, cyber-physical systems, plus the major technology characteristics of logic and memory devices.
The 2019 Roadmap is now available on the iNEMI website. It is free to iNEMI members; pricing information for non-members is available online at https://www.inemi.org/2019-roadmap-overview
For the 2019 Roadmap, chapters are being published in waves, with two to eight chapters included in each wave, released every two to three weeks. The first wave, already available online, included four chapters: Smart Manufacturing; Modeling; Simulation & Design Tools; Sustainable Electronics; and Board Assembly.
The International Electronics Manufacturing Initiative’s mission is to forecast and accelerate improvements in the electronics manufacturing industry for a sustainable future. The consortium is made up of more than 90 manufacturers, suppliers, industry associations and consortia, government agencies, research institutes and universities. iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, executes collaborative projects to eliminate these gaps (both business and technical) and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government agencies, universities and other funding agencies to set priorities for future industry needs and R&D initiatives. iNEMI is based in Morrisville, North Carolina. For additional information about iNEMI, visit http://www.inemi.org.