Join iNEMI at NEPCON China in Shanghai for a workshop on new developments and future plans for low-temperature solder materials and assembly techniques. We are hosting an all-day workshop on April 24 as part of the 2019 SMTA China East Conference, held in conjunction with NEPCON China. Topics include the innovations required to improve yield and quality of low-temperature solder assemblies; processability, reliability and failure mechanisms of low-temperature solder materials; and more. We will also identify collaborative project opportunities to accelerate low-temperature solder technology development and deployment in the industry. Click here for additional details, including agenda and registration. The workshop is co-sponsored by SMTA China and NEPCON Microelectronics China 2019
Also, be sure to check out presentations from iNEMI’s Next-Generation Solder Materials Workshop held at IPC APEX EXPO earlier this year.