iNEMI Hosts Webinar to Update Simulation Results for Warpage Characteristics of Organic Packages Project

Wednesday, September 30, 2020

This webinar will report updated simulation results for Phase 4 of the Warpage Characteristics of Organic Packages project. The end-of-project webinar for this project included a preliminary assessment of the use of FEA modeling for optimizing package warpage. At the time, the team saw inconsistencies in the results of modeling vs. experiments for Cu/mold bi-material strip warpage.

Predicting strip warpage after the molding process is a challenge for the IC packaging industry because simulation tools need to consider multiple processes and complex material properties. The project team conducted further simulations to study cure shrinkage properties and the post mold cure (PMC) process. The results indicate that curing has significant impact on warpage amplitude and the PMC process does not affect warpage trends. The studies also demonstrate that simulation can capture warpage at high temperatures.

This webinar is open to members and non-members; advance registration is required.

Wednesday, September 30, 2020
9:00-10:00 a.m. CST (China)
9:00-10:00 p.m. EDT (Americas) on September 29
Register for this webinar

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