iNEMI Board Assembly Tech Topic Series Webinar: Surface Finish Selection for Advanced PCB and Chip Substrates
Board Assembly Tech Topic Series
Surface Finish Selection for Advanced
PCB and Chip Substrates
John Swanson (MacDermid Alpha)
July 21/22, 2021
The advanced printed circuit board and related chip substrate serve as the foundation for design and construction of almost all modern electronic devices. The convenience, speed and processing power of today’s devices depend on smart design decisions, along with material and process choices properly suited to the electronic assembly as well as the end use applications. A large variety of finishes are available to designers and manufacturers and can be leveraged to support a wide range of electronics applications.
In this webinar John Swanson, Director of Final Finishes for MacDermid Alpha Circuitry Solutions, will discuss the strengths and weaknesses of available finishes, with consideration given to ease of manufacturing, assembly limitations, cost and fit to key advanced designs.
Registration
This webinar is open and free to industry; advance registration is required. Click on the link below for additional details and to register. If you have any questions, please contact Haley Fu (haley.fu@inemi.org).
Surface Finish Selection for Advanced PCB and Chip Substrates
Thursday, July 22, 2021
8:30-9:30 a.m. CST (China)
8:30-9:30 p.m. EDT (Americas) on July 21
Presentation from Previous Board Assembly Tech Topic Webinar
- Causes and Cures of Delamination, Cracks and Blisters in Conformal Coating Layers, Freddy Gilbert (ZESTRON)
iNEMI’s Conformal Coating Project
iNEMI recently launched the second phase of its Conformal Coating Evaluation for Improved Environmental Protection Project. Click here for details.
