iNEMI Announces Roadmap Webinar Series: Organic PCB

iNEMI is hosting a series of webinars highlighting information from our 2019 Roadmap. Leaders from the chapter working groups will present relevant market trends, key applications and other factors that are driving developments, plus current and future gaps that are impacting the industry.

The Organic PCB chapter addresses the technology needs for all forms of printed circuit boards and flexible circuits. This webinar will discuss the growing complexity of components that drive the need for multilayer PCB constructions. The continuing trends for higher speed processors, coupled with technology developments such as 5G communications, will be highlighted as these require specialized materials, in particular base laminates, as well as new fabrication techniques, such as mSAP, which will also be discussed. Considerations for dense packaging of electronics, including embedding passive and active components, are covered as well as optical PCB challenges. Advanced technologies used for organic semiconductor packaging substrates will also be included as their technologies are now being adapted for advanced high-density interconnect (HDI) PCBs.

This webinar is open to anyone; advanced registration is required.

Wednesday, April 22, 2020

11:00 a.m. EDT (US)

Register for this webinar

Mark your calendars for the following roadmap webinars. Additional sessions will be scheduled to address other chapters and to accommodate different time zones.

Wednesday, April 29
11:00 a.m. EDT (US)

Wednesday, May 6

11:00 a.m. EDT (US)

Wednesday, May 13

11:00 a.m. EDT (US)