iNEMI Announces Presentations at the SMTA International Conference

iNEMI
SMTA International

If you plan to be at SMTA International this year (October 14-18, 2018), be sure to check out the iNEMI presentations. iNEMI projects and roadmap will be represented with seven presentations and panel discussions in sessions covering harsh environments, Smart Manufacturing/Industry 4.0, advanced packaging and lead-free alloys (see list below).

In addition, iNEMI CEO Marc Benowitz and Vice President Grace O’Malley are attending the conference and available for meetings. Let them know if you’d like to get together while you’re there.

Monday, October 15

Harsh Environments Track 
Session HE1 — Predicting Component Life for Harsh Environments 
(8:30-10:00 a.m.)

8:30-9:00 a.m. Second Round Robin Evaluation of iNEMI Creep Corrosion Qualification Test
Presenter: Chen Xu (Nokia Bell Labs)

Tuesday, October 16

Technical Innovations Track
Session T12 — Industry 4.0: Why Do We Need It? 
(10:30 a.m. – 12:00 p.m.)

10:30-11:00 a.m. iNEMI Industry 4.0 (Smart Manufacturing) Roadmap 
Presenter: Ranjan Chatterjee (Cimetrix)

11:30 a.m.-noon

Panel Discussion
Moderator: Trevor Galbraith

Panelists:
Ranjan Chatterjee (Cimetrix)
Irene Sterian (Celestica)
Gregory Vance (Rockwell Automation)
Jay Gorajia (Mentor)

Advanced Packaging Technology Track
Session APT2 – Assembly and Reliability of Bottom Termination Components (2:00-4:00 p.m.)

2:00-2:30 p.m. The Influence of Printed Circuit Board Thickness on the Thermal Fatigue Reliability of Quad Flat No-Lead Packages 
Presenter: Richard Coyle (Nokia Bell Labs)

 
Thursday, October 18

Lead-Free Symposium
Session LF1 – Low Temp Solder Paste and Its Process Development 
(8:00-9:30 a.m.)

8:00-8:30 a.m. NEMI Project on Process Development of BiSn-Based Low Temperature Solder Pastes Part IV: Comprehensive Mechanical Shock Tests on POP Components Having Mixed BGA BiSn-SAC Solder Joints
Presenter: Raiyo Aspandiar (Intel)


Session LF2: High Reliability Pb-free Alloys, SAC305 and Beyond 
(10:00 a.m.—12:00 p.m.)

11:00-11:30 a.m. Alloy Composition and Thermal Fatigue of High Reliability Pb-Free Solder Alloys
Presenter: Richard Coyle (Nokia Bell Labs)


Session LF4: Reliability of Doped Sn Based Lead-Free Alloys 
(3:00-4:30 p.m.)

4:00-4:30 p.m. The Effect of Bismuth, Antimony, or Indium on the Thermal Fatigue of High Reliability Pb-Free Solder Alloys
Presenter: Richard Coyle (Nokia Bell Labs)

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