Indium Corporation’s Greg Wade, Technical Support Engineer, Global Accounts, was presented with the Committee Leadership Award by the IPC in recognition of his excellence in leadership in the development of the industry standard IPC-7526A, Stencil and Misprinted Board Cleaning Handbook.
Wade provides global technical support for Indium Corporation’s multi-national customers. He is an expert in surface mount and through-hole technologies and has more than 20 years of experience working with a number of electronics manufacturers and suppliers throughout the world. Wade is a veteran of the United States Navy and is educated in aviation RF electronics. He earned his Six Sigma Green Belt, as well as certifications on numerous equipment sets. He also holds several patents for tooling design.
Indium Corporation is a materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email email@example.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.