Indium Corporation’s , Technical Support Engineer for PCB Assembly Materials, will moderate two expert panels at International Conference for Electronics Enabling Technologies (ICEET) from June 5-7, in Markham, Ontario, Canada.
Sandy-Smith will moderate the Warpage Induced Defects and Component Warpage Limits panel. This panel features professionals from Plexus, Rockwell Collins, and Akrometrix.
Sandy-Smith will also moderate the Low-Melting Point Solder Pastes panel. Panelists will include Indium Corporation’s Dr. HongWen Zhang, Research Metallurgist, along with professionals from Alpha Assembly Solutions and Nihon Superior.
Sandy-Smith will also present Process and Materials Interaction Investigation: Or How to Measure Post-Process Assembly Surface Reliability.
Sandy-Smith is an industry leader renowned for her technical knowledge and support. As a Technical Support Engineer based at Indium Corporation’s headquarters in Clinton, NY, she specializes in PCB Assembly Materials and works closely with customers to develop custom solutions and optimize their processes. Sandy-Smith has a passion for developing and implementing standardization for test methods and is an SMTA Certified Process Engineer. She is active in several IPC committees, SMTA programs, and iNEMI projects, and currently serves as Chair of the J-004 committee and as Vice President of technical programs for the SMTA Empire chapter. She graduated from the International Engineering Program at the University of Rhode Island with a degree in chemical engineering and German language.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.