Indium Corporation to Feature Solder Paste for LED Manufacturing at Touch Taiwan

Indium Corporation will feature its proven Indium3.2HF Solder Paste for LED manufacturing at Touch Taiwan Display International, August 28-30 in Taipei, Taiwan.

 

The use of high-power LEDs, MicroLEDs, and MiniLEDs is growing exponentially due to light quality, energy efficiency, and reliability. These attributes are directly related to design and assembly methods and materials. Indium Corporation’s Indium3.2HF Solder Paste provides:

  • Consistent printing performance
  • Long stencil life
  • Outstanding slump resistance
  • Excellent wetting ability
  • Superior fine-pitch soldering ability
  • Water-washable flux residue

Indium Corporation also provides a myriad of materials for LED manufacturing, such as IndiTriTM or indium trichloride for manufacturing common MOCVD precursor materials, metal-based thermal interface materials (TIMs), gold-tin solder preforms and pastes, and ultra-low voiding solder pastes.  

See Indium Corporation’s experts at the show or visit www.indium.com/LED to learn more.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

 

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another®(#FOETA), at www.facebook.com/indium or @IndiumCorp.

 

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