Indium Corporation to Feature Materials for HIA at Electronics Packaging Symposium

Indium Corporation will feature its proven materials for Heterogeneous Integration & Assembly (HIA) at the 31^st Annual Electronics Packaging Symposium, September 5-6 in Niskayuna, New York, USA.

Indium Corporation’s soldering materials for HIA applications have a proven track record of success in more than two billon front-end module SiP devices manufactured over the last three years.

From water-soluble to no-clean soldering solutions,

Indium Corporation’s portfolio of products meets current and evolving challenges encountered in fine-pitch HIA applications:

• 3D logic/memory and flip-chip:
  • Wafer bumping (bump fusion) fluxes
  • Flip-chip flux
• Lidded MEMS:
  • Dispensable fine-pitch solder paste
• System-in-package:
  • Wafer level ball-attach flux
  • Ultrafine-pitch solder paste
• Ball grid array
  • Ball-attach flux

See Indium Corporation’s experts at the show or visit the company’s HIA page at www.indium.com/HIA to learn more.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil^®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another^®(#FOETA), at www.facebook.com/indium or @IndiumCorp.