Indium Corporation to Feature Innovative Materials for Power Electronics at PCIM

As one of the leading materials providers to the power electronics assembly industry, Indium Corporation^® will proudly showcase a selection of innovative products at PCIM Europe, May 9-11, in Nuremberg, Germany. Indium Corporation’s products for power electronics have been demonstrated to reduce energy consumption and solve warpage issues for its customers while ensuring high reliability and improving overall efficiency.

Featured products include:

• InTACK™ – a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. Designed for use in no-flux reflow applications with formic acid, InTACK™ is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, reducing the dependency on tooling without compromising soldering or sintering quality.
• InFORMS^® – reinforced solder alloy fabrications that improve mechanical and thermal reliability and are specifically designed to produce consistent bondline thickness for power module applications. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
• Indalloy^®301 LT Alloy for Preforms/InFORMS^® – a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys. Specifically designed for power module applications, this alloy prevents warpage in package-cooler attach scenarios without sacrificing reliability like traditional bismuth-containing low-temperature alloys. It is available in preforms, ribbon, or InFORMS^®.
• InFORCE^™29 – a pressure copper sinter paste for high-reliability, high thermal conductivity, die-attach applications, InFORCE^™29 features high workability, making it suitable for printing or dispensing applications. InFORCE^™29 provides excellent sinter performance on bare copper surfaces without the need for costly gold or silver plating.
• InFORCE^™MF – a pressure silver sinter paste for the highest reliability, highest thermal conductivity, die-attach applications, InFORCE^™MF is specially formulated for printing applications providing low process yield loss due to print defects and reduces the need for overprint. With a high metal load and low organic content, it enables fast drying times and less material loss.
• Durafuse^® HT – based on a novel alloy technology, designed to deliver a tin-rich, high-temperature lead-free (HTLF) paste, presenting the merits of both constituent alloys. Durafuse^® HT delivers simplified processing, with no special equipment needed, and enhanced thermal cycling reliability equal to or higher than a high-Pb solder.

To learn more about Indium Corporation’s solutions for power electronics, be sure to visit with our experts at PCIM in hall 6, stand #460.

About Indium Corporation

Indium Corporation^® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil^®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another^® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.

About PCIM Europe

PCIM Europe is the leading international exhibition for the community of power electronics and its applications. The event offers an international audience the opportunity to learn about products throughout the entire value chain, discover the latest trends, and exchange ideas with experts from all over the world.