Indium Corporation to Feature InFORMS® Reinforced Solder Preforms at IMAPS 2018

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS^®, at IMAPS 2018, Oct. 8-11 in Pasadena, Calif.

Indium Corporation is redefining solder with its InFORMS^® solder preforms. InFORMS^® are a composite preform consisting of solder with a reinforcing matrix. This results in:

• Improved mechanical and thermal reliability
• Uniform bondline thickness
• Low-voiding performance

InFORMS^® do more than just bond two surfaces. These solder preforms are designed to address some specific challenges to the power electronics industry.

InFORMS^® provide engineers with an enhanced material for the development of more reliable and higher performance modules. Due to the planarity improvements and stand-off tolerances, the package design becomes more predictable. In addition, stronger and more dependable joints allow for high power densities.

For more information about InFORMS^®, visit www.indium.com/informs or visit us at booth #722.