Indium Corporation to Feature AuSn Solder Preforms at NEPCON Japan 2019

Indium Corporation will feature its high-reliability precision AuSn Solder Preforms at the 48^th NEPCON Japan, Jan. 16-18 in Tokyo, Japan.

Indium Corporation’s AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining and sealing. The semiconductor-grade AuSn preforms are designed to meet industry challenges as devices continue to get smaller, with increasing power density and power ratings.

Depending on the alloy, gold-based solders have a melting point ranging from 280-1,064°C, making it compatible with subsequent reflow processes. Additionly, gold-based solders are resistant to corrosion, provide superior thermal fatigue resistance, and exhibit excellent joint strength.

Indium Corporation’s Pb-free and RoHS-compliant AuSn solder preforms are available in a variety of standard and custom-engineered designs.

For more information about Indium Corporation’s AuSn solder preforms, see our experts at the show or visit www.indium.com/gold.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil^®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another^® (#FOETA), at www.facebook.com/indium or @IndiumCorp.