Indium Corporation Technical Manager to Present on Solder Solutions for Cutting-Edge Solutions for AI and Automotive at SEMICON Taiwan September 5

Indium Corporation Senior Area Technical Manager Jason Chou will present on the timely topics of AI and EV technology at SEMICON Taiwan on September 5 in Taipei,Taiwan. Chou’s presentation will highlight cutting-edge, high-reliability, and low-temperature solder solutions for these rapidly evolving markets.

As AI and EV technologies demand higher performance, increased reliability, and more complex package and assembly requirements, Chou will examine a novel, mixed-alloy solder technology. This innovative solution leverages the combined strengths of each constituent solder powder in the paste. Specifically, variations of this mixed alloy technology have been optimized as a low-temperature drop shock solution and high-reliability alloy technology, uniquely suited for specific assembly challenges.

“We are confident that this new, award-winning mixed-alloy solder system provides timely and innovative solutions to many of the challenges posed by the emergence of EV and AI technologies,” said Chou. “I look forward to sharing more about this cutting-edge material with my industry colleagues at SEMICON Taiwan.”

As the Senior Area Technical Manager in Taiwan, Chou provides technical support to customers focusing on the semiconductor industry. He has 10 years of industry experience, specializing in front-end wafer fabrication processes, thin-film modules, and defect analysis for wafer metrology. Chou earned a master’s degree in chemistry from National Tsing Hua University and a bachelor’s degree in chemistry from National Cheng Kung University. He served as the group leader for the National Nano Device Laboratory, in Tainan, Taiwan, where he collaborated with university professors and industry professionals on semiconductor manufacturing projects.