Indium Corporation Launches InFORMS® ESM02 for Die-Level Bonding

Indium Corporation has launched InFORMS® ESM02, a reinforced matrixed solder composite specifically designed to produce consistent bondline thickness for die-level attach applications.

Indium Corporation’s InFORMS® ESM02 is a reinforced solder fabrication that produces a high-reliability solder joint with increased thermal and mechanical performance.

Until recently, InFORMS® technology was only applied at the baseplate level. New production capabilities have expanded its use to the die-level with a bondline of 50μm. Other benefits of InFORMS® include:

  • Drop-in replacement for other bondline control methods
  • Increased lateral strength
Standard InFORMS® Configurations
Description Standoff (Microns)
LM04 100
LM06 150
LM08 200
SM04 100
ESM03 75
ESM02 50
  • Bondline co-planarity
  • Improved thermal cycling reliability
  • Available in ribbon and preforms

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or  email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

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