Indium Corporation Honored with Two Global Technology Awards at Productronica

Indium Corporation was honored with two prestigious GLOBAL Technology Awards during anawards ceremony on November 14 at Productronica in Munich, Germany. The company was honored in both the Flux and Adhesives/Underfills Encapsulants categories for NC-809, a halogen-free, ultra-low residue flip-chip flux, and InTACK™, a drop-in, robust tacking agent for power module assembly, respectively. Presented by Global SMT & Packaging, the Global Technology Awards recognize the best new innovations in the printed circuit assembly and packaging industries introduced in the past 12 months.

Engineered with high-tack characteristics, NC-809 is an ultra-low residue (ULR) flux designed to hold fine-pitch die or solder spheres in place without risk of shift during the assembly process. It leaves minimal residue after reflow which makes NC-809 compatible with flip-chip assembly process where a cleaning process is not desired. NC-809, due to its lack of residue, is compatible with many common underfill materials. NC-809 exhibits superior wetting performance and is the first ULR flux qualified for ball grid array ball-attach applications for packages that are sensitive to traditional water cleaning processes. NC-809 also improves production yields by eliminating costly cleaning steps which can increase substrate warpage both after reflow and before the underfilling steps, creating the potential for die damage and cracked solder joints.

To learn more about this product and Indium Corporation’s suite of proven ultra-low residue fluxes, visit www.indium.com/products/fluxes/semiconductor-fluxes/.

InTACK™ is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. Designed for use in no-flux reflow applications with formic acid, InTACK™ is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, creating a low-cost tooling-free solution without compromising soldering quality. While InTACK™ has the tack strength to hold materials in place, the material is completely evaporated out during reflow, eliminating the time consuming post-reflow residue cleaning steps.

For more information about InTACK™, contact Indium Corporation Product Manager – ESM/Power Electronics Joe Hertline.