Indium Corporation’s Heat-Spring® is designed for use in the burn-in process. It is patterned to optimize contact with non-planar surfaces with a pressure range of only 35-100+ psi. Heat-Spring® is available in InAg and InSn alloys and pure indium.
HSMF-OS has a multi-layer construction with a total thickness of 0.004” that is designed for multiple insertions. It has an aluminum layer that acts as an interface with the device under test, and has a tensile strength of approximately 90 MPa with a soft, compliant polymer backing, which provides a configuration with “designed-in” insertion survivability.
To learn more about Indium Corporation’s metal thermal interface materials for burn-in and test, visit www.indium.com/bits.
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