Indium Corporation Features Indium3.2HF Solder Paste for Fine Feature Printing at SEMICON Taiwan

Indium Corporation will feature its Indium3.2HF Solder Paste at SEMICON Taiwan 2018 September 5-7 in Taipei, Taiwan.

Indium Corporation’s Indium3.2HF is a water-soluble, halogen-free, Pb-free solder paste. Indium3.2HF formulated with Indium Corporation’s Type 6SG powder is ideal for fine feature printing applications.

Indium3.2HF offers consistent, repeatable printing performance combined with a long stencil life. In addition, Indium3.2HF delivers:

  • Good response-to-pause
  • A wide reflow profile window
  • Outstanding slump resistance
  • Excellent wetting capability
  • Superior fine-pitch soldering ability

From water-soluble solder pastes to ultra-low residue, no-clean fluxes, Indium Corporation has an industry-proven portfolio of products that meet the current and evolving challenges encountered in fine-pitch SiP applications.

For more information on Indium Corporation’s materials for SiP or Indium3.2HF Solder Paste, visit www.indium.com/SiP or visit Indium Corporation’s booth J2240.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

 

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